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Intel Core i3-380M 2.53 GHz Arrandale, 988 - processor, tray

Manufacturer: INTEL
ID: CP80617004116AH
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This product is end of life or currently not available.
Specifications
Description
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Technical details
Product typeProcessor
Processor cache3072 KB
StatusDiscontinued
Launch dateQ3'10
Product nameIntel Core i3-380M (3M Cache, 2.53 GHz)
Born on dateQ3'10
Graphics max dynamic frequency667 MHz
Bus type unitsGT/s
Bus bandwidth2.5
Maximum memory8 GB
Processor brand nameIntel Core i3
Last change63903513
Product familyPrevious Generation Intel Core i3 Processor
Processor
Processor modeli3-380M
Processor lithography32 nm
Processor familyIntel Core i3
Boxcross
Processor socket988
Processor cores2
CPU multiplier (bus/core ratio)19
System bus rate2.5 GT/s
Processor threads4
Processor operating modes64-bit
Component forNotebook
Processor cache3 MB
Bus typeDMI
Processor frequency2.53 GHz
Processor codenameArrandale
Processor cache typeSmart Cache
Processor seriesIntel Core i3-300 Mobile series
Memory bandwidth supported by processor (max)17.1 GB/s
Processor ARK ID50178
Memory
ECCcross
Memory channelsDual
Maximum internal memory supported by processor8 GB
Memory types supported by processorDDR3 800/1066
Memory clock speeds supported by processor800,1066 MHz
Weight & dimensions
Processor package sizerPGA 37.5x 37.5, BGA 34x28
Energy management
Thermal Design Power (TDP)35 W
Operational conditions
Operating temperature (T-T)0 - 90 °C
Tjunction90 °C
Other features
Maximum internal memory8192 MB
L1 cache0.064 MB
Intel® Virtualization Technology (Intel® VT)checkmark
Cache memory3 MB
Graphics
On-board graphics card modelcheckmark
On-board graphics cardcheckmark
On-board graphics card base frequency500 MHz
On-board graphics card dynamic frequency (max)667 MHz
Number of displays supported (on-board graphics)2
Processor special features
Intel® vPro™ Technologycross
Intel® Hyper Threading Technology (Intel® HT Technology)checkmark
Intel® Turbo Boost Technologycross
Intel FDI Technologycheckmark
Intel® Clear Video HD Technology (Intel® CVT HD)checkmark
Intel Dual Display Capable Technologycheckmark
Intel Fast Memory Accesscheckmark
Intel Flex Memory Accesscheckmark
Intel® AES New Instructions (Intel® AES-NI)cross
Enhanced Intel SpeedStep Technologycheckmark
Intel Trusted Execution Technologycross
Intel Enhanced Halt Statecheckmark
Intel® Clear Video Technology for Mobile Internet Devices (Intel CVT for MID)checkmark
Intel VT-x with Extended Page Tables (EPT)checkmark
Intel 64checkmark
Intel Virtualization Technology for Directed I/O (VT-d)cross
Macrovision License Requiredcross
Intel Clear Video Technologycheckmark
Intel Virtualization Technology (VT-x)checkmark
Features
Supported instruction setsSSE4.1/4.2
PCI Express slots version2.0
Execute Disable Bitcheckmark
Idle Statescheckmark
Thermal Monitoring Technologiescheckmark
CPU configuration (max)1
Number of Processing Die Transistors382 M
Embedded options availablecross
Processing Die size81 mm²
Number of Graphics & IMC Die Transistors177 M
Graphics & IMC lithography45 nm
Graphics & IMC Die Size114 mm²
PCI Express configurations1x16
Maximum number of PCI Express lanes16
Physical Address Extension (PAE)36 bit
Market segmentMBL
EAN

Intel® Hyper-Threading Technology
Intel® Hyper-Threading Technology (Intel® HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner.

Idle States
Idle States (C-states) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.

Enhanced Intel SpeedStep® Technology
Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.

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The above technical details are for reference only and may change without notice. We reserve the right to correct printing errors and use illustrations for guidance. Some text may be auto-generated or machine-translated, which could lead to inaccuracies.

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