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Intel Core i7-940XM 2.13 GHz Clarksfield, 988 - processor, tray (No iGPU)

Manufacturer: INTEL
ID: BY80607002526AE
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Specifications
Description
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Technical details
Product typeProcessor
Processor cache8192 KB
StatusDiscontinued
Launch dateQ3'10
Product nameIntel Core i7-940XM Extreme Edition (8M Cache, 2.13 GHz)
Born on dateQ3'10
Bus type unitsGT/s
Bus bandwidth2.5
Maximum memory8 GB
Processor brand nameIntel Core i7 Extreme Edition
Intel Core i7 Processor Extreme Edition
Last change63903513
Product familyPrevious Generation Intel Core i7 Extreme Processor
Processor
Processor modeli7-940XM
Processor lithography45 nm
Processor familyIntel Core i7
Boxcross
Processor socket988
SteppingB1
Processor cores4
Processor codeSLBSC
CPU multiplier (bus/core ratio)16
System bus rate2.5 GT/s
Processor threads8
Processor operating modes64-bit
Processor boost frequency3.33 GHz
Processor cache8 MB
Bus typeDMI
Processor frequency2.13 GHz
Processor codenameClarksfield
Processor cache typeSmart Cache
Processor seriesIntel Core i7-900 Mobile Extreme Edition series
Memory bandwidth supported by processor (max)21 GB/s
Processor ARK ID43127
Memory
ECCcross
Memory channelsDual
Maximum internal memory supported by processor8 GB
Memory types supported by processorDDR3 1066/1333
Weight & dimensions
Processor package size37.5 x 37.5 mm
Energy management
Thermal Design Power (TDP)55 W
Operational conditions
Tjunction100 °C
Other features
Maximum internal memory8192 MB
Cache memory8 MB
Graphics
On-board graphics cardcross
Processor special features
Intel® vPro™ Technologycross
Intel® Hyper Threading Technology (Intel® HT Technology)checkmark
Intel® Turbo Boost Technology1.0
Intel® AES New Instructions (Intel® AES-NI)cross
Enhanced Intel SpeedStep Technologycheckmark
Intel Trusted Execution Technologycheckmark
Intel Enhanced Halt Statecheckmark
Intel VT-x with Extended Page Tables (EPT)checkmark
Intel Demand Based Switchingcross
Intel 64checkmark
Intel Virtualization Technology for Directed I/O (VT-d)checkmark
Intel Virtualization Technology (VT-x)checkmark
Features
Supported instruction setsSSE4.2
PCI Express slots version2
Execute Disable Bitcheckmark
Idle Statescheckmark
Thermal Monitoring Technologiescheckmark
CPU configuration (max)1
Number of Processing Die Transistors774 M
Embedded options availablecross
Processing Die size296 mm²
Number of Graphics & IMC Die Transistors774 M
PCI Express configurations1x16,2x8
Maximum number of PCI Express lanes16
Physical Address Extension (PAE)36 bit
Market segmentMBL
Source: Icecat.biz

The world's best family of laptop processors
Intel's leading-edge PC processor breaks free of the desktop with the new Intel® Core™ i7 processor for laptops, delivering unmatched mobile technology for intelligent performance on the most demanding tasks, such as creating digital video and playing intense games.
Revolutionary mobile performance, no strings or wires attached

Including massive memory bandwidth that accelerates workloads, upgrading to laptops with Intel® Core™ i7 mobile processors provide hardware-based technologies that deliver the ultimate in rich, high-definition (HD) content creation, video encoding and editing, multitasking, and more.

Intel® Turbo Boost Technology
Intel® Turbo Boost Technology dynamically increases the processor's frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don’t.

Intel® Hyper-Threading Technology
Intel® Hyper-Threading Technology (Intel® HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner.

Enhanced Intel SpeedStep® Technology
Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.

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The above technical details are for reference only and may change without notice. We reserve the right to correct printing errors and use illustrations for guidance. Some text may be auto-generated or machine-translated, which could lead to inaccuracies.

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