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Key Specifications
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Weight | 886 g |
Package weight | 1.4 kg |
Height | 160 mm |
Width | 150 mm |
Depth | 129 mm |
Package depth | 208 mm |
Package height | 190 mm |
Package width | 192 mm |
Heatsink weight | 732 g |
Fan dimensions (W x D x H) | 120 x 120 x 25 mm |
Energy management | |
Power consumption (typical) | 1.08 W |
Maximum current | 0.09 A |
Voltage | 12 V |
Other features | |
Product life | 40000 h |
Heatsink dimensions (W x D x H) | 139 x 102 x 160.4 mm |
Design | |
Product colour | Black |
Number of heat pipes | 6 |
Performance | |
Type | Cooler |
Mean time between failures (MTBF) | 40000 h |
Fan diameter | 12 cm |
Supported processor sockets | Socket AM2, Socket AM2+, Socket AM3, Socket AM3+, Socket FM1, Socket FM2, Socket FM2+, LGA 1151 (Socket H4), LGA 2011-v3 (Socket R) |
Suitable location | Processor |
Maximum airflow | 44.2 cfm |
Minimum airflow (imperial) | 26.6 cfm |
Minimum air pressure | 0.6 mmH2O |
Maximum air pressure | 1.6 mmH2O |
Noise level (low speed) | 11 dB |
Noise level (high speed) | 20 dB |
Rotational speed (max) | 1300 RPM |
Rotational speed (min) | 800 RPM |
EAN | 4719512047828 |
Warranty | 1 year |
Source: Icecat.biz |
The Cooler Master Hyper 612 Ver.2 provides excellent CPU cooling performance. It features a large fin structure that accelerates heat dissipation by maximizing surface area. Hyper 612 Ver.2's intelligent 120mm PWM fan ensures a low noise solution. Six direct contact heatpipes and folding fin structure effectively guides air and provides an accelerated cooling system.
The Cooler Master Hyper 612 Ver.2 provides excellent CPU cooling performance. It features a large fin structure that accelerates heat dissipation by maximizing surface area. Hyper 612 Ver.2's intelligent 120mm PWM fan ensures a low noise solution. Six direct contact heatpipes and folding fin structure effectively guides air and provides an accelerated cooling system.
DIRECT THERMAL TRANSFER
Six (6) Direct Contact Heatpipes for accelerated surface to surface thermal transfer.
EXCELLENT HEAT DISTRIBUTION
Folding Fin Structure for the best air guiding, increased efficiency and heat dissipation
X-VENT TECHNOLOGY
Air-Guide design places 45 degree angled vents around each Direct Contact Heatpipe for better cooling.
EASY INSTALLATION
Easy-to-use, universal mounting system for all common Intel and AMD platforms.
MEASUREMENT DIAGRAM
Hyper 612 V2 optimized profile for greater mid tower compatibility and memory clearance.
COVERAGE
Parts, product replacement, and free technical support.
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