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Intel Core i3-380M 2.53 GHz Arrandale, 988 - processor, tray
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Key Specifications
Choose one or multiple features to search for items that have the same specifications.Technical details | |
Product type | Processor |
Processor cache | 3072 KB |
Status | Discontinued |
Launch date | Q3'10 |
Product name | Intel Core i3-380M (3M Cache, 2.53 GHz) |
Born on date | Q3'10 |
Graphics max dynamic frequency | 667 MHz |
Bus type units | GT/s |
Bus bandwidth | 2.5 |
Maximum memory | 8 GB |
Processor brand name | Intel Core i3 |
Last change | 63903513 |
Product family | Previous Generation Intel Core i3 Processor |
Processor | |
Processor model | i3-380M |
Processor lithography | 32 nm |
Processor family | Intel Core i3 |
Box | ![]() |
Processor socket | 988 |
Processor cores | 2 |
CPU multiplier (bus/core ratio) | 19 |
System bus rate | 2.5 GT/s |
Processor threads | 4 |
Processor operating modes | 64-bit |
Component for | Notebook |
Processor cache | 3 MB |
Bus type | DMI |
Processor frequency | 2.53 GHz |
Processor codename | Arrandale |
Processor cache type | Smart Cache |
Processor series | Intel Core i3-300 Mobile series |
Memory bandwidth supported by processor (max) | 17.1 GB/s |
Processor ARK ID | 50178 |
Memory | |
ECC | ![]() |
Memory channels | Dual |
Maximum internal memory supported by processor | 8 GB |
Memory types supported by processor | DDR3 800/1066 |
Memory clock speeds supported by processor | 800,1066 MHz |
Weight & dimensions | |
Processor package size | rPGA 37.5x 37.5, BGA 34x28 |
Energy management | |
Thermal Design Power (TDP) | 35 W |
Operational conditions | |
Operating temperature (T-T) | 0 - 90 °C |
Tjunction | 90 °C |
Other features | |
Maximum internal memory | 8192 MB |
L1 cache | 0.064 MB |
Intel® Virtualization Technology (Intel® VT) | ![]() |
Cache memory | 3 MB |
Graphics | |
On-board graphics card model | ![]() |
On-board graphics card | ![]() |
On-board graphics card base frequency | 500 MHz |
On-board graphics card dynamic frequency (max) | 667 MHz |
Number of displays supported (on-board graphics) | 2 |
Processor special features | |
Intel® vPro™ Technology | ![]() |
Intel® Hyper Threading Technology (Intel® HT Technology) | ![]() |
Intel® Turbo Boost Technology | ![]() |
Intel FDI Technology | ![]() |
Intel® Clear Video HD Technology (Intel® CVT HD) | ![]() |
Intel Dual Display Capable Technology | ![]() |
Intel Fast Memory Access | ![]() |
Intel Flex Memory Access | ![]() |
Intel® AES New Instructions (Intel® AES-NI) | ![]() |
Enhanced Intel SpeedStep Technology | ![]() |
Intel Trusted Execution Technology | ![]() |
Intel Enhanced Halt State | ![]() |
Intel® Clear Video Technology for Mobile Internet Devices (Intel CVT for MID) | ![]() |
Intel VT-x with Extended Page Tables (EPT) | ![]() |
Intel 64 | ![]() |
Intel Virtualization Technology for Directed I/O (VT-d) | ![]() |
Macrovision License Required | ![]() |
Intel Clear Video Technology | ![]() |
Intel Virtualization Technology (VT-x) | ![]() |
Features | |
Supported instruction sets | SSE4.1/4.2 |
PCI Express slots version | 2.0 |
Execute Disable Bit | ![]() |
Idle States | ![]() |
Thermal Monitoring Technologies | ![]() |
CPU configuration (max) | 1 |
Number of Processing Die Transistors | 382 M |
Embedded options available | ![]() |
Processing Die size | 81 mm² |
Number of Graphics & IMC Die Transistors | 177 M |
Graphics & IMC lithography | 45 nm |
Graphics & IMC Die Size | 114 mm² |
PCI Express configurations | 1x16 |
Maximum number of PCI Express lanes | 16 |
Physical Address Extension (PAE) | 36 bit |
Market segment | MBL |
EAN |
Intel® Hyper-Threading Technology
Intel® Hyper-Threading Technology (Intel® HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner.
Idle States
Idle States (C-states) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.
Enhanced Intel SpeedStep® Technology
Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.
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