ADATA XPG Lancer Blade 16GB (1 x 16GB) DDR5 6400 MHz, CL32 Memory, White (XMP/EXPO)
Key Specifications
Choose one or multiple features to search for items that have the same specifications.| Technical details | |
| Compliance certificates | RoHS, CE |
| Memory | |
| Intel Extreme Memory Profile (XMP) | ![]() |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Weight & dimensions | |
| Weight | 36.2 g |
| Height | 33.8 mm |
| Other features | |
| Number of pins | 288 |
| Features | |
| Internal memory type | DDR5 |
| ECC | ![]() |
| CAS latency | 32 |
| Product colour | White |
| Memory clock speed | 6400 MHz |
| Backlight | ![]() |
| RoHS compliance | ![]() |
| Memory form factor | DIMM |
| Memory channels | Single-channel |
| Internal memory | 16 GB |
| Product type | Random-access memory |
| Memory data transfer rate | 6400 MT/s |
| AMD Extended Profiles for Overclocking (EXPO) | ![]() |
| EAN | 4711085944627 |
The ADATA XPG Lancer Blade is a single 16 GB DDR5 memory module engineered for performance-oriented desktop systems. It operates at a frequency of 6400 MT/s with a CAS latency of 32, providing the data throughput required for modern gaming, content creation, and intensive multitasking. As an unbuffered, non-ECC module, it is designed for consumer-grade motherboards. This single-module configuration offers a direct upgrade path for users planning to add more memory in the future.
This module features a low-profile heatsink with a height of 33.8 mm, ensuring compatibility with a wide range of PC cases and large CPU air coolers where space is limited. The white heatsink provides efficient thermal dissipation to maintain stability under load. For simplified performance tuning, the memory supports both Intel XMP 3.0 and AMD EXPO profiles. This allows for straightforward, one-click overclocking on compatible platforms without the need for manual voltage or timing adjustments.
Key Features:- 16 GB DDR5 memory capacity (1 x 16 GB)
- Operates at a speed of 6400 MT/s
- Features a CAS Latency of 32
- Low-profile design with a 33.8 mm height
- Equipped with a white heatsink for thermal management
- Supports Intel XMP 3.0 for overclocking
- Supports AMD EXPO for overclocking
- Standard 288-pin DIMM form factor
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Estimated delivery time: 14.04
Estimated delivery time: 13.04
Estimated delivery time: 13.04
Estimated delivery time: 14.04


