Thermal Grizzly Minus Pad 8 100 x 100 x 2.0mm Thermal Pad, Pink

The Thermal Grizzly Minus Pad 8 (100 x 100 x 2.0 mm) is a thermal interface material designed to transfer heat between electronic components and heatsinks. With a thermal conductivity of 8 W/m·K, this pad serves as an alternative to thermal paste, bridging gaps between voltage regulators, memory chips, and other power components. Its ceramic-silicon formula, containing nano aluminium oxide, maintains low thermal resistance across the contact surface. This material is suitable for applications where a liquid interface is impractical.

At 2.0 mm thick, the pad is compressible enough to fill gaps between hardware surfaces. As the material is electrically non-conductive, it can be safely applied near exposed traces without risking short circuits. The 3.5 g/cm³ density allows the pad to conform to components under mounting pressure. The non-corrosive composition prevents damage to copper or aluminium heatsink bases during extended use. The pre-cut format allows users to trim the sheet to the required size for custom applications.

• Electrically insulating: prevents short circuits when applied to components with dense electrical contacts.
• Metal oxide and silicone composition: prevents the material from bleeding or drying out over time.
• Highly compressible: deforms under mounting pressure to ensure a secure fit between components.
• 100 x 100 mm sheet size: can be trimmed to fit multiple small chips or larger power components.
• Low thermal resistance: helps maintain lower operating temperatures compared to standard gap fillers.