Intel Core i9 i9-13900F 2.0 GHz 36 MB, LGA 1700 - processor, boxed
Key Specifications
Choose one or multiple features to search for items that have the same specifications.| Technical details | |
| Status | Launched |
| Launch date | Q1'23 |
| Maximum memory | 192 GB |
| Target market | Gaming, Content Creation |
| Processor | |
| Processor model | i9-13900F |
| Processor manufacturer | Intel |
| Processor lithography | 7 nm |
| Processor family | Intel Core i9 |
| Processor socket | LGA 1700 |
| Package type | Box |
| Processor cores | 24 |
| Processor threads | 32 |
| Processor operating modes | 64-bit |
| Processor boost frequency | 5.6 GHz |
| Processor cache | 36 MB |
| Bus type | DMI4 |
| Processor frequency | 2.0 GHz |
| Thermal Design Power (TDP) | 65 W |
| Processor codename | Raptor Lake |
| Processor cache type | Smart Cache |
| Memory bandwidth supported by processor (max) | 89.6 GB/s |
| Processor ARK ID | 230502 |
| Cooler included | ![]() |
| Processor base frequency | 2 GHz |
| Efficient cores | 16 |
| Performance cores | 8 |
| Maximum number of DMI lanes | 8 |
| Processor base power | 65 W |
| Maximum turbo power | 219 W |
| Efficient-core base frequency | 1.5 GHz |
| Efficient-core boost frequency | 4.2 GHz |
| Performance-core base frequency | 2 GHz |
| Performance-core boost frequency | 5.2 GHz |
| Processor generation | 13th Gen Intel® Core |
| Memory | |
| Non-ECC | ![]() |
| Memory bandwidth (max) | 89.6 GB/s |
| Memory channels | Dual-channel |
| Maximum internal memory supported by processor | 192 GB |
| Memory types supported by processor | DDR4-SDRAM, DDR5-SDRAM |
| Weight & dimensions | |
| Processor package size | 45 x 37.5 mm |
| Operational conditions | |
| Tjunction | 100 °C |
| Other features | |
| Maximum internal memory | 192 GB |
| L2 cache | 32768 KB |
| Graphics | |
| On-board graphics card model | Not available |
| Discrete graphics card model | Not available |
| On-board graphics card | ![]() |
| Discrete graphics card | ![]() |
| Processor special features | |
| Intel® Hyper Threading Technology (Intel® HT Technology) | ![]() |
| Intel® Turbo Boost Technology | 2.0 |
| Intel® AES New Instructions (Intel® AES-NI) | ![]() |
| Enhanced Intel SpeedStep Technology | ![]() |
| Intel VT-x with Extended Page Tables (EPT) | ![]() |
| Intel® Secure Key | ![]() |
| Intel 64 | ![]() |
| Intel® OS Guard | ![]() |
| Intel Virtualization Technology for Directed I/O (VT-d) | ![]() |
| Intel Virtualization Technology (VT-x) | ![]() |
| Intel Turbo Boost Max Technology 3.0 | ![]() |
| Intel® Speed Shift Technology | ![]() |
![]() | |
| Intel® Thermal Velocity Boost | ![]() |
| Mode-based Execute Control (MBE) | ![]() |
| Intel® Deep Learning Boost (Intel® DL Boost) on CPU | ![]() |
| Intel® Volume Management Device (VMD) | ![]() |
| Intel® Control-flow Enforcement Technology (CET) | ![]() |
| Intel® Thermal Velocity Boost Frequency | 5.6 GHz |
| Intel® Turbo Boost Max Technology 3.0 frequency | 5.5 GHz |
| Intel® Thread Director | ![]() |
| Intel® Gaussian & Neural Accelerator (Intel® GNA) 3.0 | ![]() |
| Intel® Adaptive Boost Technology | ![]() |
| Intel® Standard Manageability (ISM) | ![]() |
| Features | |
| Supported instruction sets | SSE4.1, SSE4.2, AVX 2.0 |
| PCI Express slots version | 5.0, 4.0 |
| Execute Disable Bit | ![]() |
| Idle States | ![]() |
| Thermal Monitoring Technologies | ![]() |
| Scalability | 1S |
| CPU configuration (max) | 1 |
| Embedded options available | ![]() |
| PCI Express configurations | 1x16+1x4, 2x8+1x4 |
| Maximum number of PCI Express lanes | 20 |
| Market segment | Desktop |
| Export Control Classification Number (ECCN) | 5A992C |
| Commodity Classification Automated Tracking System (CCATS) | 740.17B1 |
| Use conditions | PC/Client/Tablet |
| Direct Media Interface (DMI) Revision | 4.0 |
| Logistics data | |
| Harmonized System (HS) code | 8542310001 |
| EAN | 5032037260183 |
| Warranty | 1 year |
The Intel Core i9-13900F is a 13th-generation desktop processor designed using the Raptor Lake architecture for high-performance computing. It features a hybrid core configuration comprising performance and efficient cores to distribute workloads effectively between primary tasks and background processes. The hardware provides compatibility with modern motherboard chipsets designed for professional workstations and servers. It serves as a central component for systems requiring high computational throughput, such as high-end gaming builds or creative media production environments. This processor is built to manage heavy parallel processing requirements in multi-threaded applications.
As an \"F-series\" model, this CPU does not include onboard graphics and requires the installation of a discrete graphics card for display output. The hardware architecture facilitates high-speed data transfer through integrated controller functionality for storage and peripheral connectivity. This component is designed for multitasking environments where high thread counts are necessary for processing large datasets or rendering complex media. It operates within a standard power envelope while utilizing internal thermal management features to handle high-frequency operation during peak demand.
Key Features:- LGA 1700 socket type
- 24 cores and 32 threads
- 2.0 GHz base clock frequency
- 5.6 GHz boost clock frequency
- 36 MB Smart Cache size
- 7 nm manufacturing process
- 65 W thermal design power
- DDR4 3200 MHz and DDR5 5600 MHz memory compatibility
- 192 GB maximum supported memory
- Dual-channel memory architecture
- PCIe 5.0 and 4.0 support
- Boxed packaging with included cooler
Estimated delivery: 19.01
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Estimated delivery time: 20.01
Estimated delivery time: 19.01
Estimated delivery time: 20.01
Estimated delivery time: 20.01
Estimated delivery time: 19.01
Estimated delivery time: 19.01
Estimated delivery time: 20.01


