1290€
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Multitronic Vaasa
Multitronic Pietarsaari
Multitronic Jyväskylä
Multitronic Lappeenranta
Multitronic Mariehamn
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Specifications
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| Technical details | |
| Low thermal resistance |  |
| Weight & dimensions | |
| Weight | 3 g |
| Packaging data | |
| Package type | Blister |
| Quantity per pack | 2 pc(s) |
| Features | |
| Type | Thermal paste |
| Operating temperature (T-T) | -50 - 250 °C |
| Product colour | Grey |
| Thermal resistance | 0.03 °C/W |
| Easy to install | |
| Thermal conductivity | 6.2 W/m·K |
| Minimum operating temperature | -50 °C |
| Product type | Thermal paste |
| Non-conductive | |
| Density | 2.6 g/cm³ |
| Specific gravity | 2.6 g/cm³ |
| EAN | 6933412700111 |
The DeepCool EX750 thermal paste is designed for heat transfer between CPUs or GPUs and cooling assemblies in desktop and portable systems. It features a thermal conductivity of 6.2 W/m·K and a low thermal resistance of 0.03 °C/W. This grey, nonconductive compound has a density of 2.6 g/cm³ and operates between -50°C and +250°C. Each blister pack includes two 3g units of thermal compound to assist with installation and maintenance.
Multitronic Vaasa: 0 pcs
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Multitronic Pietarsaari: 0 pcs
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Multitronic Jyväskylä: 0 pcs
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Multitronic Lappeenranta: 0 pcs
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Multitronic Mariehamn: 0 pcs
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Today: 10:00 - 17:00
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The above technical details are for reference only and may change without notice. We reserve the right to correct printing errors and use illustrations for guidance. Some text may be auto-generated or machine-translated, which could lead to inaccuracies.