Kingston FURY Impact 16GB (2 x 8GB) DDR4 3200 MHz, CL20 Memory (XMP)
Key Specifications
Choose one or multiple features to search for items that have the same specifications.| Memory | |
| CAS latency | 20 |
| Memory form factor | SO-DIMM |
| Component for | PC/server |
| Intel Extreme Memory Profile (XMP) | ![]() |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Other features | |
| Number of pins | 260 |
| Features | |
| Internal memory type | DDR4 |
| ECC | ![]() |
| CAS latency | 20 |
| Product colour | Black |
| Memory clock speed | 3200 MHz |
| RoHS compliance | ![]() |
| Memory form factor | SO-DIMM |
| Internal memory | 16 GB |
| Product type | Random-access memory |
| Memory layout (modules x size) | 2 x 8 GB |
| EAN | 0740617318425 |
| Warranty | 5 years |
The Kingston FURY Impact DDR4 SO-DIMM kit is engineered to provide a direct performance enhancement for laptops and small form factor PCs. This 16GB dual-channel kit, configured as two 8GB modules, operates at a frequency of 3200 MHz with a CAS latency of 20. These specifications facilitate more responsive multitasking and quicker load times for demanding applications and games. The modules are designed to fit standard 260-pin DDR4 slots, ensuring broad compatibility with supported systems that utilize this compact memory form factor.
These memory modules function at a low operating voltage of 1.2V, which contributes to a cooler and more power-efficient system, a notable factor for battery-powered devices. The kit supports Intel XMP 2.0 profiles, allowing for straightforward configuration to the advertised speeds on compatible Intel-based platforms. It is also validated as AMD Ryzen Ready, ensuring stable and reliable performance with corresponding AMD processors. The design features a minimal black PCB that integrates visually into most internal component layouts without requiring a dedicated heat spreader.
Key Features:- Memory Capacity: 16 GB (2 x 8 GB)
- Memory Type: DDR4
- Form Factor: SO-DIMM
- Speed: 3200 MHz
- Latency: CL20
- Voltage: 1.2 V
- Channel Configuration: Dual Channel
- Intel XMP 2.0 Ready: Yes
- AMD Ryzen Ready: Yes
- Module Height: 30 mm
- Cooling Method: Black PCB
Estimated delivery: 25.05
Today: Closed
Estimated delivery: 25.05
Today: Closed
Estimated delivery: 25.05
Today: Closed
Estimated delivery: 25.05
Today: Closed
Estimated delivery: 25.05
Today: Closed
Estimated delivery time: 25.05
Estimated delivery time: 25.05
Estimated delivery time: 26.05
Estimated delivery time: 26.05
Estimated delivery time: 26.05
Estimated delivery time: 25.05
Estimated delivery time: 25.05
Estimated delivery time: 26.05
- leaflet (English)


