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Intel Core i5-6400T 2.2 GHz Skylake, LGA 1151 - processor, tray
This product is end of life or currently not available.
Key Specifications
Choose one or multiple features to search for items that have the same specifications.Technical details | |
Maximum graphics card memory | 64 GB |
Video compression formats | |
Supported memory types | DDR4 |
Product type | Processor |
Processor cache | 6144 KB |
Status | Discontinued |
Maximum resolution & refresh rate (DisplayPort) | 4096x2304@60Hz |
Maximum resolution & refresh rate (HDMI) | 4096x2304@24Hz |
Maximum resolution & refresh rate (VGA) | N/A |
Maximum resolution & refresh rate (Integrated Flat Panel) | 4096x2304@60Hz |
OpenGL support | |
Launch date | Q3'15 |
Product name | Intel Core i5-6400T (6M Cache, up to 2.80 GHz) |
Number of graphics cores | 2 |
Born on date | Q3'15 |
Graphics max dynamic frequency | 950 MHz |
Bus type units | GT/s |
Bus bandwidth | 8 |
Maximum memory | 64 GB |
Processor brand name | Intel Core i5 Intel Core i5 Processor |
Last change | 63903513 |
Product family | 6th Generation Intel Core i5 Processors |
Processor | |
Processor model | i5-6400T |
Processor manufacturer | Intel |
Processor lithography | 14 nm |
Processor family | Intel Core i5 |
Box | |
Processor socket | LGA 1151 |
Stepping | R0 |
Processor cores | 4 |
Processor code | SR2BS |
System bus rate | 8 GT/s |
Processor threads | 4 |
Compatible chipsets | Intel® B150, Intel® H110, Intel® H170, Intel® Z170, Intel Q150, Intel® Q170 |
Processor operating modes | 64-bit |
Processor boost frequency | 2.8 GHz |
Component for | PC |
Processor cache | 6 MB |
Bus type | DMI3 |
Thermal Design Power (TDP) | 35 W |
Processor codename | Skylake |
Processor cache type | Smart Cache |
Processor series | Intel Core i5-6400 Desktop series |
Memory bandwidth supported by processor (max) | 34.1 GB/s |
Processor ARK ID | 88187 |
Cooler included | |
Memory | |
ECC | |
Memory channels | Dual-channel |
Maximum internal memory supported by processor | 64 GB |
Memory types supported by processor | DDR4-SDRAM,DDR3L-SDRAM |
Memory clock speeds supported by processor | 2133,1333,1600,1866 MHz |
Memory voltage supported by processor | 1.35 V |
Weight & dimensions | |
Processor package size | 37.5 x 37.5 mm |
Operational conditions | |
Tcase | 66 °C |
Packaging data | |
Package weight | 338 g |
Package depth | 116 mm |
Package height | 101 mm |
Package width | 70 mm |
Other features | |
Maximum internal memory | 64 GB |
Video decoding | |
Intel® Virtualization Technology (Intel® VT) | VT-x,VT-d |
Cache memory | 6 MB |
Graphics output | eDP/DP/HDMI/DVI |
Graphics | |
On-board graphics card model | Intel® HD Graphics 530 |
On-board graphics card | |
On-board graphics card base frequency | 350 MHz |
On-board graphics card dynamic frequency (max) | 950 MHz |
On-board graphics card burst frequency | 950 MHz |
On-board graphics card outputs supported | Embedded DisplayPort (eDP),DisplayPort,HDMI,DVI |
On-board graphics card maximum resolution (DisplayPort) | 4096 x 2304 pixels |
On-board graphics card ID | 0x1912 |
On-board graphics card 4K support | |
On-board graphics card maximum resolution (eDP - Integrated Flat Panel) | 4096 x 2304 pixels |
On-board graphics card refresh rate at maximum resolution (eDP - Integrated Flat Panel) | 60 Hz |
On-board graphics card refresh rate at maximum resolution (DisplayPort) | 60 Hz |
On-board graphics card refresh rate at maximum resolution (HDMI) | 24 Hz |
Maximum on-board graphics card memory | 64 GB |
Number of displays supported (on-board graphics) | 3 |
On-board graphics card maximum resolution (HDMI) | 4096 x 2304 pixels |
On-board graphics card DirectX version | 12.0 |
On-board graphics card OpenGL version | 4.5 |
Processor special features | |
Intel® Identity Protection Technology (Intel® IPT) | |
Intel® Hyper Threading Technology (Intel® HT Technology) | |
Intel® Turbo Boost Technology | 2.0 |
Intel® Quick Sync Video Technology | |
Intel® InTru™ 3D Technology | |
Intel® Wireless Display (Intel® WiDi) | |
Intel® Clear Video HD Technology (Intel® CVT HD) | |
Intel® Insider™ | |
Intel® AES New Instructions (Intel® AES-NI) | |
Enhanced Intel SpeedStep Technology | |
Intel Trusted Execution Technology | |
Intel Enhanced Halt State | |
Intel® Clear Video Technology for Mobile Internet Devices (Intel CVT for MID) | |
Intel VT-x with Extended Page Tables (EPT) | |
Intel® Small Business Advantage (Intel® SBA) | |
Intel TSX-NI | |
Intel® Secure Key | |
Intel 64 | |
Intel Stable Image Platform Program (SIPP) | |
Intel® OS Guard | |
Intel Virtualization Technology for Directed I/O (VT-d) | |
Intel Clear Video Technology | |
Intel Software Guard Extensions (Intel SGX) | |
Intel Identity Protection Technology version | 1.00 |
Intel Secure Key Technology version | 1.00 |
Intel Small Business Advantage (SBA) version | 1.00 |
Intel Virtualization Technology (VT-x) | |
Intel Stable Image Platform Program (SIPP) version | 0.00 |
Intel TSX-NI version | 0.00 |
Conflict-Free processor | |
Intel® Optane™ Memory Ready | |
Intel® Memory Protection Extensions (Intel® MPX) | |
Features | |
Supported instruction sets | SSE4.1,SSE4.2,AVX 2.0 |
PCI Express slots version | 3.0 |
Execute Disable Bit | |
Idle States | |
Thermal Monitoring Technologies | |
Scalability | 1S |
CPU configuration (max) | 1 |
Embedded options available | |
Graphics & IMC lithography | 14 nm |
PCI Express configurations | 1x16,2x8,1x8+2x4 |
Thermal solution specification | PCG 2015A |
Maximum number of PCI Express lanes | 16 |
Market segment | Desktop |
EAN | 675901346412 |
Warranty | 1 year |
Conflict Free
“Conflict free” means “DRC conflict free”, which is defined by the U.S. Securities and Exchange Commission rules to mean products that do not contain conflict minerals (tin, tantalum, tungsten and/or gold) that directly or indirectly finance or benefit armed groups in the Democratic Republic of the Congo (DRC) or adjoining countries.
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