DCG ThinkSystem

Processor
Processor model	8170
Number of processors installed	4
Processor lithography	14 nm
Processor family	Intel® Xeon® Platinum
Processor socket	LGA 3647
Stepping	H0
Supported instruction sets	AVX,AVX 2.0,AVX-512,SSE4.2
Processor cores	26
Processor code	SR37H
Processor operating modes	64-bit
Processor boost frequency	3.70 GHz
Processor cache	35.75 MB
Execute Disable Bit
Scalability	S8S
Tcase	89 °C
Embedded options available
Processor frequency	2.10 GHz
Thermal Design Power (TDP)	165 W
Processor codename	Skylake
Maximum number of PCI Express lanes	48
Processor cache type	L3
Maximum internal memory supported by processor	768 GB
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	2666 MHz
Memory channels supported by processor	Hepta
ECC supported by processor
Processor package size	76.0 x 56.5
Conflict-Free processor
Memory
Internal memory type	DDR4-SDRAM
Memory slots	48 x DIMM
Maximum internal memory	6000 GB
ECC
Memory clock speed	2666 MHz
Memory layout (slots x size)	4 x 32 GB
Internal memory	128 GB
Ports & interfaces
Serial ports quantity	1
VGA (D-Sub) ports quantity	1
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	3
Weight & dimensions
Height	86.5 mm
Width	482 mm
Depth	763.7 mm
Energy management
Power supply	1600 W
Redundant power supply (RPS) support
Number of redundant power supplies installed	2
Operational conditions
Operating altitude	0 - 3048 m
Operating relative humidity (H-H)	8 - 90%
Storage temperature (T-T)	-10 - 60 °C
Operating temperature (T-T)	5 - 45 °C
Storage relative humidity (H-H)	8 - 90%
Storage
RAID levels	0, 1, 5, 6, 10, 50, 60
Hot-swap
Supported HDD sizes	2.5"
RAID support
Supported storage drive interfaces	SAS, Serial ATA III, M.2
Supported RAID controllers	930-8i
Certificates
Energy Star certified
Expansion slots
PCI Express slots version	3.0
PCI Express x8 (Gen 3.x) slots	7
PCI Express x16 (Gen 3.x) slots	2
Design
Rack mounting
Chassis type	Rack (2U)
Optical drive type	N
Redundant fans support
Rack rails
Graphics
On-board graphics card model	Matrox G200
Processor special features
Intel® Hyper Threading Technology (Intel® HT Technology)
Intel® Turbo Boost Technology	2.0
Intel® AES New Instructions (Intel® AES-NI)
Enhanced Intel SpeedStep Technology
Intel Trusted Execution Technology
Intel VT-x with Extended Page Tables (EPT)
Intel TSX-NI
Intel 64
Intel Virtualization Technology for Directed I/O (VT-d)
Intel Virtualization Technology (VT-x)
Processor ARK ID	120506
Performance
Performance management	XClarity Advanced
Trusted Platform Module (TPM)
Trusted Platform Module (TPM) version	1.2
EAN
Warranty	1 year
Source: Icecat.biz

Growth is inevitable

The Lenovo ThinkSystem SR850 is built to deliver the performance and reliability you require today, with the scalability and versatility you’ll need as you advance toward the “future-defined” data center.

The flexible 2U SR850 can scale from two to four powerful Intel® Xeon® processor Scalable family CPUs, with up to 233 percent more cores and 400 percent more memory than the previous-generation server, achieving up to 76 percent faster performance. Built for standard workloads like general business applications and server consolidation, it can also accommodate high-growth areas such as databases and virtualization. The agile design of ThinkSystem SR850 provides rapid upgrades for processors and memory, and its large, flexible storage capacity helps you keep pace with data growth.

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