Key Specifications
Choose one or multiple features to search for items that have the same specifications.| Technical details | |
| Non-curing | ![]() |
| Non-corrosive | ![]() |
| Low thermal resistance | ![]() |
| Sustainability compliance | ![]() |
| Compliance certificates | RoHS |
| Weight & dimensions | |
| Weight | 5 g |
| Volume | 5 ml |
| Packaging data | |
| Quantity | 1 |
| Spatula | ![]() |
| Package type | Syringe |
| Scraper | ![]() |
| Quantity per pack | 1 pc(s) |
| Packaging content | |
| Screws included | ![]() |
| Other features | |
| Thermal grease | ![]() |
| Design | |
| RoHS compliance | ![]() |
| Features | |
| Type | Thermal paste |
| Operating temperature (T-T) | -45 - 240 °C |
| Product colour | Grey |
| Easy to install | ![]() |
| Viscosity note | 76 cPs |
| Thermal conductivity | 2.4 W/m·K |
| Minimum operating temperature | -50 °C |
| Product type | Thermal paste |
| Non-toxic | ![]() |
| Non-conductive | ![]() |
| Density | 2.5 g/cm³ |
| EAN | 4710614524354 |
The Akasa AK-455-5G (5 g) is a grey thermal paste with a conductivity of 2.4 W/m·K, designed to fill microscopic gaps between a processor and a heatsink. It is supplied in a 5 g syringe for precise application, and its non-curing formula maintains its consistency over time. With a density of 2.5 g/cm³, the paste spreads easily across the contact surface, ensuring effective heat transfer between the components.
The paste is compatible with all standard CPU and heatsink surfaces. Its electrically non-conductive and non-corrosive composition prevents short circuits should the material come into contact with motherboard traces. It remains stable at temperatures ranging from -50 °C to 240 °C, ensuring performance under various thermal loads. A spatula is included to assist with creating an even layer across the heat spreader. The product is fully RoHS compliant.
Key Features:- Non-toxic formula for safe handling.
- 5 g tube provides enough paste for multiple applications.
- Low thermal resistance aids efficient heat dissipation.
- Syringe allows for precise application to prevent overflow onto the CPU socket.
- Included spatula helps achieve the thin layer necessary for optimal thermal performance.
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