Noctua NT-H1 1.4g Thermal Paste

The Noctua NT-H1 (1.4 g) is a thermal compound designed to transfer heat in computer systems. It fills microscopic gaps between the processor and the heatsink, improving cooling efficiency for CPUs and GPUs. Its low thermal resistance helps minimize heat buildup during heavy workloads, providing a stable, reliable option for PC builders.

The non-conductive, non-corrosive formula prevents electrical shorts if the paste touches motherboard traces. It is compatible with common heatsink materials, including copper, aluminium, and nickel-plating. The 1.4 g tube contains enough paste for several installations and maintains its consistency across a wide range of operating temperatures. The paste can be applied directly to the chip without degrading over time, and the syringe-style packaging keeps it ready for future maintenance.

• A density of 2.49 g/cm³ allows for a thin, uniform layer between components.
• The white paste is easy to see against hardware during application.
• Simple application; no complex preparation or spreading tools are required.
• Syringe packaging keeps the thermal grease protected.
• Compatible with both air-cooled and liquid-cooled systems.